IEC 62951-8:2023

IEC 62951-8
®

Edition 1.0 2023-01
INTERNATIONAL
STANDARD

colour
inside


Semiconductor devices – Flexible and stretchable semiconductor devices –
Part 8: Test method for stretchability, flexibility, and stability of flexible resistive
memory
IEC 62951-8:2023-01(en)

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IEC 62951-8

®


Edition 1.0 2023-01




INTERNATIONAL



STANDARD








colour

inside










Semiconductor devices – Flexible and stretchable semiconductor devices –

Part 8: Test method for stretchability, flexibility, and stability of flexible resistive

memory

























INTERNATIONAL

ELECTROTECHNICAL


COMMISSION





ICS 31.080.99 ISBN 978-2-8322-6333-4




  Warning! Make sure that you obtained this publication from an authorized distributor.


® Registered trademark of the International Electrotechnical Commission

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– 2 – IEC 62951-8:2023 © IEC 2023
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Test method . 6
4.1 General . 6
4.2 Test equipment and tools . 6
4.3 Test procedures . 8
4.3.1 Stretchability test . 8
4.3.2 Flexibility test . 9
4.3.3 Stability testing . 10
4.4 Test report . 11
Annex A (informative) Induced strain on a substrate due to bending . 12
A.1 Detailed derivation of the strain formula by bending . 12
A.2 Simulation results induced strain by bending. 13
Bibliography . 14

Figure 1 – Examples experimental setup for testing stretchability (top) and flexibility
(bottom) . 7
Figure 2 – Schematic for stretchability test denoting parameters before and during
testing . 9
Figure 3 – Schematic for flexibility test denoting parameters before and during testing . 10
Figure A.1 – Deformation of a substrate induced strain by bending . 12
Figure A.2 – Deformation of a substrate induced tensile strain by stretching . 13

Table 1 – Performance parameters of resistive type memory . 6
Table 2 – Example temperature and relative humidity conditions . 11

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IEC 62951-8:2023 © IEC 2023 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

SEMICONDUCTOR DEVICES –
FLEXIBLE AND STRETCHABLE SEMICONDUCTOR DEVICES –

Part 8: Test method for stretchability, flexibility,
and stability of flexible resistive memory

FOREWORD
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IEC 62951-8 has been prepared by IEC technical committee 47: Semiconductor devices. It is
an International Standard.
The text of this International standard is based on the following documents:
Draft Report on voting
47/2786/FDIS 47/2793/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
The language used for the development of International Standard is English.

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– 4 – IEC 62951-8:2023 © IEC 2023
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/standardsdev/publications.
A list of all parts in the IEC 62951 series, published under the general title Semiconductor
devices – Flexible and stretchable semiconductor devices, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until the
stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data related to
the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The "colour inside" logo on the cover page of this document indicates that it
contains colours which are considered to be useful for the correct understanding of its
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IEC 62951-8:2023 © IEC 2023 – 5 –
SEMICONDUCTOR DEVICES –
FLEXIBLE AND STRETCHABLE SEMICONDUCTOR DEVICES –

Part 8: Test method for stretchability, flexibility,
and stability of flexible resistive memory



1 Scope
This part of IEC 62951 defines terms and specifies the test method for evaluating the
stretchability, flexibility, and stability of flexible resistive memory. The test method descriptions
include experimental procedures and the equipment to be used. It also includes general
requirements for test conditions such as the temperature and relative humidity of the testing
environment. The test method described in this document focuses on stability evaluation rather
than reliability.
2 Normative references
There are no normative references in this document.
3 Terms and definitions
For the purpose of this document, the following terms and definitions apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at https://www.electropedia.org/
• ISO Online browsing platform: available at https://www.iso.org/obp
3.1
flexible resistive memory
flexible device that works by changing the resistance between dielectric materials
3.2
bending radius
measured to th
...