Passive RF and microwave devices, intermodulation level measurement - Part 8: Measurement of passive intermodulation generated by objects exposed to RF radiation

IEC 62037-8:2022 defines a radiated passive intermodulation (PIM) test to determine PIM levels generated by a device or object when it is exposed to RF radiation. This test can be conducted on any material or object and is not limited to devices designed to propagate RF signals. This test can be conducted as either a near field or far field test as defined by the test specification in an outdoor test site or in an anechoic test chamber.

Dispositifs RF et à micro-ondes passifs, mesure du niveau d’intermodulation - Partie 8: Mesure de l’intermodulation passive générée par des objets exposés au rayonnement RF

IEC 62037-8:2022 définit un essai d’intermodulation passive (PIM) rayonnée pour déterminer les niveaux d’intermodulation passive générés par un dispositif ou un objet lorsqu’il est exposé à un rayonnement RF. Cet essai peut être effectué sur tout matériau ou objet et n’est pas limité aux dispositifs conçus pour propager des signaux RF. Cet essai peut être effectué en champ proche ou en champ lointain, selon ce qui est défini dans la spécification d’essai sur un site d’essai extérieur ou à l’intérieur d’une chambre d’essai anéchoïque.

General Information

Status
Published
Publication Date
15-Nov-2022
Current Stage
PPUB - Publication issued
Start Date
18-Nov-2022
Completion Date
16-Nov-2022
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IEC 62037-8
®

Edition 1.0 2022-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside


Passive RF and microwave devices, intermodulation level measurement –
Part 8: Measurement of passive intermodulation generated by objects exposed
to RF radiation

Dispositifs RF et à micro-ondes passifs, mesure du niveau d’intermodulation –
Partie 8: Mesure de l’intermodulation passive générée par des objets exposés
au rayonnement RF

IEC 62037-8:2022-11(en-fr)

---------------------- Page: 1 ----------------------
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IEC 62037-8

®


Edition 1.0 2022-11




INTERNATIONAL



STANDARD




NORME


INTERNATIONALE
colour

inside










Passive RF and microwave devices, intermodulation level measurement –

Part 8: Measurement of passive intermodulation generated by objects exposed

to RF radiation



Dispositifs RF et à micro-ondes passifs, mesure du niveau d’intermodulation –

Partie 8: Mesure de l’intermodulation passive générée par des objets exposés


au rayonnement RF













INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE


INTERNATIONALE




ICS 33.120.01 ISBN 978-2-8322-5884-2




Warning! Make sure that you obtained this publication from an authorized distributor.

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® Registered trademark of the International Electrotechnical Commission
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---------------------- Page: 3 ----------------------
– 2 – IEC 62037-8:2022 © IEC 2022
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms, definitions and abbreviated terms . 5
3.1 Terms and definitions . 5
3.2 Abbreviated terms . 5
4 General considerations . 6
4.1 Test environment . 6
4.2 Safety . 6
5 Test set-up . 6
5.1 Test configurations . 6
5.1.1 General . 6
5.1.2 Antenna type . 7
5.1.3 Antenna directivity . 7
5.1.4 Antenna VSWR . 8
5.1.5 Antenna polarization . 8
5.1.6 DUT location . 8
5.1.7 DUT orientation . 9
5.2 Dynamic stimulus . 10
5.3 Verification tests . 10
5.3.1 Residual PIM verification . 10
5.3.2 VSWR verification . 10
6 Test specification . 10
7 Report . 11

Figure 1 – Radiated PIM test set-up, single antenna, single band . 6
Figure 2 – Radiated PIM test set-up, dual antenna, dual band . 7
Figure 3 – Radiated PIM test set-up, dual antenna, single band . 7
Figure 4 – Test zone definition . 9
Figure 5 – Flat object definition . 9
Figure 6 – Rotate antenna or DUT to change polarization . 10

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IEC 62037-8:2022 © IEC 2022 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

PASSIVE RF AND MICROWAVE DEVICES,
INTERMODULATION LEVEL MEASUREMENT –

Part 8: Measurement of passive intermodulation
generated by objects exposed to RF radiation

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
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3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 62037-8 has been prepared by technical committee 46: Cables, wires, waveguides, RF
connectors, RF and microwave passive components and accessories. It is an International
Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
46/902/FDIS 46/911/RVD

Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.

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– 4 – IEC 62037-8:2022 © IEC 2022
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/standardsdev/publications.
A list of all parts of the IEC 62037 series, under the general title: Passive RF and microwave
devices, intermodulation level measurement, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The "colour inside" logo on the cover page of this document indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this document using a colour printer.

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IEC 62037-8:2022 © IEC 2022 – 5 –
PASSIVE RF AND MICROWAVE DEVICES,
INTERMODULATION LEVEL MEASUREMENT –

Part 8: Measurement of passive intermodulation
generated by objects exposed to RF radiation



1 Scope
This part of IEC 62037 defines a radiated passive intermodulation (PIM) test to determine PIM
levels generated by a device or object when it is exposed to RF radiation. This test can be
conducted on any material or object and is not limited to devices designed to propagate RF
signals. This test can be conducted as either a near field or far field test as defined by the test
specification in an outdoor test site or in an anechoic test chamber.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 62037-1, Passive RF and microwave devices, intermodulation level measurement – Part 1:
General requirements and measuring methods
IEC 62037-6:2021, Passive RF and microwave devices, intermodulation level measurement –
Part 6: Measurement of passive intermodulation in antennas
3 Terms, definitions and abbreviated terms
3.1 Terms and definitions
No terms and definitions are listed in this document.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at https://www.electropedia.org/
• ISO Online browsing platform: available at https://www.iso.org/obp
3.2 Abbreviated terms
AIM Active intermodulation
DUT Device under test
IM Intermodulation
PIM Passive intermodulation

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– 6 – IEC 62037-8:2022 © IEC 2022
4 General considerations
4.1 Test environment
When applicable, radiated PIM measurements can be accomplished outdoors. In performing
such a test, it is important to ensure that government regulations pertaining to the maximum
authorized RF radiation levels are met. Also, the RF energy radiated by the test antenna can
generate PIM in surrounding structures other than the DUT which can couple back into the test
antenna resulting in invalid PIM test results. Additionally, external sources of RF radiation can
interfere with the test measurements. A survey of the frequencies and power magnitude locally
in use is recommended prior to testing. External sources of PIM in the test environment can be
minimized or eliminated by performing the test within an anechoic test chamber providing a low
PIM test environment. More information on the construction of anechoic test chambers suitable
for PIM testing is provided in IEC 62037-6:2021, 6.8.
4.2 Safety
Performing PIM tests with antenna products can be dangerous. Potentially high voltages and
high levels of RF energy can be present within the test environment. The DUT should be
positioned such that personnel will not be exposed to electromagnetic fields exceeding the
acceptable levels specified by government agencies.
5 Test set-up
5.1 Test configurations
5.1.1 General
A typical test set-up for radiated PIM testing is shown in Figure 1. Low PIM components should
be used to construct the test system and the overall cable or waveguide lengths should be
minimized to deliver maximum power to the transmitting antenna. Sufficient isolation shall be
provided between the transmit and receive paths to prevent active intermodulation (AIM) within
the test system receiver.
A second set-up for radiated PIM testing is shown in Figure 2. This configuration can be used
to measure IM products that are outside of the operating bandwidth of the transmitting antenna.
A third set-up for radiated PIM testing is shown in Figure 3. This configuration can be used
when the residual PIM of the test antenna is higher than desired, preventing accurate
measurement of the DUT.


Figure 1 – Radiated PIM test set-up, single antenna, single band

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IEC 62037-8:2022 © IEC 2022 – 7 –


Figure 2 – Radiated PIM test set-up, dual antenna, dual band


Figure 3 – Radiated PIM test set-up, dual antenna, single band
5.1.2 Antenna type
The transmit and receive antenna(s) will be directional panel or horn type antennas.
5.1.3 Antenna directivity
The transmit and receive antenna directivity will be 10,25 dBi ± 3,0 dBi at the f , f and IM
1 2
product test frequencies, where directivity is calculated using the formula:
Directivity = 4 1253 / (BW × BW )
A E
where
BW is the half power azimuth beam width of test antenna;
A
BW is the half power elevation beam width of test antenna.
E

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– 8 – IEC 62037-8:2022 © IEC 2022
5.1.4 Antenna VSWR
The transmit and receive antenna VSWR (voltage standing wave ratio) shall be < 1,92:1 (10 dB
return loss) at the f f and IM product test frequencies when measured in the test environment
1, 2
excluding the DUT and DUT support structure (if required).
5.1.5 Antenna polarization
The transmit and receive antennas shall be linearly polarized. If separate transmit and receive
antennas are used, the two antennas will be co-polarized while measuring PIM.
5.1.6 DUT location
5.1.6.1 DUT distance from transmit antenna
5.1.6.1.1 General
Radiated PIM tests can be conducted in either the near field or the far field region of the test
system transmit antenna. Distance is defined as the shortest direct path between the front face
of the transmit antenna and the closest point on the DUT. Unless otherwise specified, the
following test distances will be used for far field and near field tests.
5.1.6.1.2 Far field test
2
Far field tests will be conducted within a distance range of 2 × D /λ ± 0,25 × λ, where λ is the
lowest f or f test frequency wavelength and D is the largest linear dimension of the transmit
1 2
antenna.
5.1.6.1.3 Near field test
Near field tests will be conducted at a distance of 1 × λ ± 0,1 × λ, where λ is the lowest f or f
1 2
test frequency wavelength.
5.1.6.2 DUT location within the antenna beam
The center of the DUT will be positioned at the center of the transmit antenna’s main beam with
no part of the DUT extending outside of the transmit antenna’s half-power azimuth or elevation
beam widths, as shown in Figure 4. If the DUT is too large to meet this requirement, it is
acceptable to move the DUT and repeat the test until all areas of the DUT have been exposed
to the required level of RF energy. It is acceptable to move the DUT while PIM testing to meet
this requirement if human safety is not at risk.
Maximum test zone width = D + 2 × S × Tan (BW /2)
MIN A
where
D is the test antenna width or height, whichever is smaller;
MIN
S is the separation between antenna and DUT;
BW is the half power azimuth beam width of test antenna.
A
Maximum test zone height = D + 2 × S × Tan (BW /2)
MIN E
where
D is the test antenna width or height, whichever is smaller;
MIN
S is the separation between antenna and DUT;
BW is the half power elevation beam width of test antenna.
E

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IEC 62037-8:2022 © IEC 2022 – 9 –

Figure 4 – Test zone definition
5.1.7 DUT orientation
During the radiated PIM test, devices/objects should be positioned in front of the test antenna
in an orientation that simulates how they would normally be oriented in the field.
5.1.7.1 DUT surfaces to radiate
5.1.7.1.1 Flat objects
Flat objects/devices are those whose vertical and horizontal aspect ratios (h/t and w/t) are >10
as shown in Figure 5. The radiated PIM test will be conducted on the front and rear surfaces
(DUT rotated 180°) only for flat objects/devices.
w / t > 10
and
h / t > 10


Figure 5 – Flat object definition
5.1.7.1.2 Non-flat objects
For non-flat objects/devices, the radiated PIM test will be conducted on the front surface, left
surface (DUT rotated 90°), right surface (DUT rotated −90°) and rear surface (DUT rotated
180°). Unless otherwise specified, top and bottom surfaces will not be tested.
5.1.7.2 DUT orientation relative to antenna polarization
Radiated PIM tests will be conducted at two orthogonal polarizations for each DUT surface
tested. This can be accomplished by rotating the transmit and receive antenna(s) by 90°, by
radiating the DUT with orthogonal polarization ports of a dual polarized antenna, or by rotating
the DUT by 90° as shown in Figure 6. It is acceptable to rotate the DUT while testing to meet
this requirement.

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– 10 – IEC 62037-8:2022 © IEC 2022


Figure 6 – Rotate antenna or DUT to change polarization
5.2 Dynamic stimulus
A dynamic stimulus shall be applied while performing a radiated PIM test. The purpose for
applying a dynamic stimulus is to identify the presence of any loose metal-to-metal contacts
within the device or object. The stimulus does not have to simulate in-use conditions to identify
loose connections. Tap tests, flex tests, impact tests or vibration tests are all acceptable
stimulus methods. A dynamic stimulus will be selected that is appropriate for the type and form
of object/device under test. The test specification will describe how and where the dynamic
stimulus will be applied as well as the number of cycles or test duration.
5.3 Verification tests
5.3.1 Residual PIM verification
Prior to performing a radiated PIM test, measure the residual PIM of the test set-up including
the test environment and DUT support structure (if required). The residual PIM of the test set-
up shall be a minimum of 10 dB lower than the PIM level to be certified in accordance with
IEC 62037-1.
5.3.2 VSWR verification
Prior to performing a radiated PIM test, measure the VSWR of the test environment including
the transmit and receive antenna(s), the RF cable(s) feeding the test antenna(s), the DUT
support structure (if required). The VSWR at the f , f and IM product test frequencies should
1 2
be <1,92:1 (10 dB return loss).
6 Test specification
Test specifications shall specify:
a) test type: near field or far field;
b) dynamic stimulus:
• describes how and where the dynamic stimulus will be applied;
• specifies the number of dynamic stimulus cycles or the test duration;
c) test power level;
d) IM product order to be measured;
e) frequency band(s) or specific test frequencies within the band(s) to be measured;
f) pass/fail IM product level.
Unique test configurations may be required to better simulate operating conditions. For those
cases, the test specification will need to document any changes relative to this specification.

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IEC 62037-8:2022 © IEC 2022 – 11 –
7 Report
The report shall document the following:
a) description of device or object tested;
b) object type (flat or non-flat);
c) test type: near field or far field;
d) test power level;
e) IM product measured;
f) pass/fail IM product level;
g) dynamic stimulus;
h) for each band tested:
• test frequencies (f , f and IM product);
1 2
• residual PIM of the test set-up for each polarization;
• peak PIM measured for each DUT surface and polarization;
• peak VSWR (or return loss) at the f , f and IM product test frequencies of the setup
1 2
without DUT;
i) any differences between the actual test method or test configuration and this specification.

___________

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– 12 – IEC 62037-8:2022 © IEC 2022
SOMMAIRE
AVANT-PROPOS . 13
1 Domaine d’application . 15
2 Références normatives . 15
3 Termes, définitions et abréviations . 15
3.1 Termes et définitions . 15
3.2 Abréviations . 15
4 Considérations générales . 16
4.1 Environnement d’essai . 16
4.2 Sécurité . 16
5 Montage d’essai . 16
5.1 Configurations d’essai . 16
5.1.1 Généralités . 16
5.1.2 Type d’antenne . 18
5.1.3 Directivité des antennes . 18
5.1.4 ROS des antennes . 18
5.1.5 Polarisation des antennes . 18
5.1.6 Emplacement du dispositif en essai . 18
5.1.7 Orientation du dispositif en essai . 19
5.2 Stimulus dynamique . 21
5.3 Essais de vérification . 21
5.3.1 Vérification de l’intermodulation passive résiduelle . 21
5.3.2 Vérification du ROS . 21
6 Spécification d’essai .
...

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