IEC 61189-2-803:2023

IEC 61189-2-803
®

Edition 1.0 2023-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE


Test methods for electrical materials, printed boards and other interconnection
structures and assemblies –
Part 2-803: Test methods for Z-axis expansion of base materials and printed
boards

Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles –
Partie 2-803: Méthodes d'essai pour la dilatation suivant l'axe Z des matériaux de
base et des cartes imprimées
IEC 61189-2-803:2023-07(en-fr)

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IEC 61189-2-803

®


Edition 1.0 2023-07




INTERNATIONAL



STANDARD




NORME


INTERNATIONALE











Test methods for electrical materials, printed boards and other interconnection

structures and assemblies –

Part 2-803: Test methods for Z-axis expansion of base materials and printed

boards



Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres


structures d'interconnexion et ensembles –

Partie 2-803: Méthodes d'essai pour la dilatation suivant l'axe Z des matériaux

de base et des cartes imprimées










INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE


INTERNATIONALE





ICS 31.180  ISBN 978-2-8322-7264-0




Warning! Make sure that you obtained this publication from an authorized distributor.

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® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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– 2 – IEC 61189-2-803:2023 © IEC 2023
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Preparation of test specimens . 5
5 Test specimens . 5
6 Test apparatus . 6
7 Test procedure . 6
8 Calculation . 6
9 Report . 7
Bibliography . 8

Figure 1 – Example TMA data output . 6

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IEC 61189-2-803:2023 © IEC 2023 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 2-803: Test methods for Z-axis expansion of base materials and
printed boards

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC Publication(s)"). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
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6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 61189-2-803 has been prepared by IEC technical committee TC 91: Electronics assembly
technology. It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
91/1760/CDV 91/1863/RVC

Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.

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– 4 – IEC 61189-2-803:2023 © IEC 2023
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/standardsdev/publications.
A list of all parts in the IEC 61189 series, published under the general title Test methods for
electrical materials, printed boards and other interconnection structures and assemblies, can
be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

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IEC 61189-2-803:2023 © IEC 2023 – 5 –
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 2-803: Test methods for Z-axis expansion of base materials and
printed boards



1 Scope
This part of IEC 61189 specifies a test method to determine the Z-axis expansion of base
materials and printed boards using a thermomechanical analyser (TMA).
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60194-1, Printed boards design, manufacture and assembly – Vocabulary – Part 1:
Common usage in printed board and electronic assembly technologies
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60194-1 apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at https://www.electropedia.org/
• ISO Online browsing platform: available at https://www.iso.org/obp
4 Preparation of test specimens
Unless otherwise specified, a minimum of two specimens shall be tested. These specimens
shall be taken from random locations of the material to be evaluated.
The test specimens shall be verified to be free of particles.
5 Test specimens
Test specimens shall be unclad laminate material or a printed circuit board. Multilayer printed
boards may be tested but no internal conductors are to be present in the specimen.
All copper shall be etched from the test specimens using standard industry methods.
The specimen shall be taken at a distance ≥ 25 mm from the edge of the material / circuit board
being evaluated. The dimensions of the specimens shall be approximately 6,35 mm × 6,35 mm
and have a minimum thickness of 0,51 mm.

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– 6 – IEC 61189-2-803:2023 © IEC 2023
The specimen shall lie flat on the test surface, so all edges of the specimen shall be sanded,
or equivalent, to make them smooth and free of burrs. Care should be taken that this process
does not induce mechanical stresses or heat the specimen.
The specimen thickness shall be measured and recorded, to allow for the percentage of thermal
expansion to be determined at the completion of the test.
6 Test apparatus
a) A thermomechanical analyser (TMA) capable of determining a dimensional change within
±0,001 mm over the defined temperature range.
b) An air circulating drying chamber capable of maintaining 105 °C ± 2 °C.
c) A low humidity drying cabinet or desiccator capable of maintaining an atmosphere less than
30 % RH at 23 °C.
7 Test procedure
a) Calibrate the TMA instrument as per the manufacturer's guidelines.
b) Precondition the specimens for 2 h ± 0,25 h at 105 °C ± 2 °C, then allow to cool to room
temperature in a low humidity drying cabinet or desiccator.
c) Once cooled, take the specimen from the low humidity drying cabinet and place it onto the
stage of the TMA equipment. Care should be taken that the specimen is resting flat in the
centre of the test stage.
d) The TMA probe is to be lowered onto the specimen and a force applied of between 1 mN
and 100 mN.
e) Lower the furnace around the test stage.
f) Begin the temperature scan; the start temperature is to be no greater than 30 °C.
g) The scan rate shall be maintained at
...