IEC TR 63378-1:2021

IEC TR 63378-1
®

Edition 1.0 2021-12
TECHNICAL
REPORT

colour
inside


Thermal standardization on semiconductor packages –
Part 1: Thermal resistance and thermal parameter of BGA, QFP type
semiconductor packages
IEC TR 63378-1:2021-12(en)

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IEC TR 63378-1

®


Edition 1.0 2021-12




TECHNICAL



REPORT








colour

inside










Thermal standardization on semiconductor packages –

Part 1: Thermal resistance and thermal parameter of BGA, QFP type

semiconductor packages

























INTERNATIONAL

ELECTROTECHNICAL


COMMISSION





ICS 31.080.01 ISBN 978-2-8322-1062-3




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® Registered trademark of the International Electrotechnical Commission

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– 2 – IEC TR 63378-1:2021 © IEC 2021
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
3.1 Terms and letter symbols related to temperature (unit [°C or K]) . 5
3.2 Terms and letter symbols related to thermal characteristics . 6
4 Accuracy of θ . 10
JA
4.1 Variation of θ . 10
JA
4.1.1 General . 10
4.1.2 Analysis model . 10
4.1.3 Simulation conditions (typical values) . 11
4.1.4 Evaluation items and standards . 11
4.1.5 Evaluation results .
...