IEC 60747-16-7:2022

IEC 60747-16-7
®

Edition 1.0 2022-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE


Semiconductor devices –
Part 16-7: Microwave integrated circuits – Attenuators

Dispositifs à semiconducteurs –
Partie 16-7: Circuits intégrés hyperfréquences – Atténuateurs

IEC 60747-16-7:2022-11(en-fr)

---------------------- Page: 1 ----------------------
THIS PUBLICATION IS COPYRIGHT PROTECTED
Copyright © 2022 IEC, Geneva, Switzerland

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.


Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite ni
utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie et
les microfilms, sans l'accord écrit de l'IEC ou du Comité national de l'IEC du pays du demandeur. Si vous avez des
questions sur le copyright de l'IEC ou si vous désirez obtenir des droits supplémentaires sur cette publication, utilisez
les coordonnées ci-après ou contactez le Comité national de l'IEC de votre pays de résidence.

IEC Secretariat Tel.: +41 22 919 02 11
3, rue de Varembé info@iec.ch
CH-1211 Geneva 20 www.iec.ch
Switzerland

About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.

IEC publications search - webstore.iec.ch/advsearchform IEC Products & Services Portal - products.iec.ch
The advanced search enables to find IEC publications by a Discover our powerful search engine and read freely all the
variety of criteria (reference number, text, technical publications previews. With a subscription you will always have
committee, …). It also gives information on projects, replaced access to up to date content tailored to your needs.
and withdrawn publications.

Electropedia - www.electropedia.org
IEC Just Published - webstore.iec.ch/justpublished
The world's leading online dictionary on electrotechnology,
Stay up to date on all new IEC publications. Just Published
containing more than 22 300 terminological entries in English
details all new publications released. Available online and once
and French, with equivalent terms in 19 additional languages.
a month by email.
Also known as the International Electrotechnical Vocabulary

(IEV) online.
IEC Customer Service Centre - webstore.iec.ch/csc
If you wish to give us your feedback on this publication or need
further assistance, please contact the Customer Service
Centre: sales@iec.ch.


A propos de l'IEC
La Commission Electrotechnique Internationale (IEC) est la première organisation mondiale qui élabore et publie des
Normes internationales pour tout ce qui a trait à l'électricité, à l'électronique et aux technologies apparentées.

A propos des publications IEC
Le contenu technique des publications IEC est constamment revu. Veuillez vous assurer que vous possédez l’édition la
plus récente, un corrigendum ou amendement peut avoir été publié.

Recherche de publications IEC - Découvrez notre puissant moteur de recherche et consultez
webstore.iec.ch/advsearchform gratuitement tous les aperçus des publications. Avec un
La recherche avancée permet de trouver des publications IEC abonnement, vous aurez toujours accès à un contenu à jour
en utilisant différents critères (numéro de référence, texte, adapté à vos besoins.
comité d’études, …). Elle donne aussi des informations sur les
projets et les publications remplacées ou retirées. Electropedia - www.electropedia.org

Le premier dictionnaire d'électrotechnologie en ligne au monde,
IEC Just Published - webstore.iec.ch/justpublished
avec plus de 22 300 articles terminologiques en anglais et en
Restez informé sur les nouvelles publications IEC. Just
français, ainsi que les termes équivalents dans 19 langues
Published détaille les nouvelles publications parues.
additionnelles. Egalement appelé Vocabulaire
Disponible en ligne et une fois par mois par email.
Electrotechnique International (IEV) en ligne.


Service Clients - webstore.iec.ch/csc
Si vous désirez nous donner des commentaires sur cette
publication ou si vous avez des questions contactez-nous:
sales@iec.ch.
IEC Products & Services Portal - products.iec.ch

---------------------- Page: 2 ----------------------
IEC 60747-16-7

®


Edition 1.0 2022-11




INTERNATIONAL



STANDARD




NORME


INTERNATIONALE











Semiconductor devices –

Part 16-7: Microwave integrated circuits – Attenuators



Dispositifs à semiconducteurs –

Partie 16-7: Circuits intégrés hyperfréquences – Atténuateurs
















INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE


INTERNATIONALE




ICS 31.080.99 ISBN 978-2-8322-6116-3




Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

---------------------- Page: 3 ----------------------
– 2 – IEC 60747-16-7:2022  IEC 2022
CONTENTS
FOREWORD . 5
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 7
4 Essential ratings and characteristics . 10
4.1 General requirements . 10
4.1.1 Circuit identification and types . 10
4.1.2 General function description . 11
4.1.3 Manufacturing technology . 11
4.1.4 Package identification . 11
4.2 Application description . 11
4.2.1 Conformance to system and/or interface information . 11
4.2.2 Overall block diagram . 11
4.2.3 Reference data . 11
4.2.4 Electrical compatibility . 11
4.2.5 Associated devices . 12
4.3 Specification of the function . 12
4.3.1 Detailed block diagram – Functional blocks . 12
4.3.2 Identification and function of terminals . 12
4.3.3 Function description . 13
4.4 Limiting values (absolute maximum rating system) . 13
4.4.1 Requirements . 13
4.4.2 Electrical limiting values . 13
4.4.3 Temperatures . 14
4.5 Operating conditions (within the specified operating temperature range) . 15
4.6 Electrical characteristics . 15
4.7 Mechanical and environmental ratings, characteristics and data . 15
4.8 Additional information . 16
5 Measuring methods . 16
5.1 General . 16
5.1.1 General precautions . 16
5.1.2 Characteristic impedance . 16
5.1.3 Handling precautions . 16
5.1.4 Types . 16
5.2 Transmission loss (L ) and insertion loss (L ) . 17
trans ins
5.2.1 Purpose . 17
5.2.2 Measuring methods . 17
5.3 Attenuation value (A ). 20
att
5.3.1 Purpose . 20
5.3.2 Measuring methods . 20
5.4 Attenuation range (A ) . 22
ran
5.4.1 Purpose . 22
5.4.2 Measuring methods . 22
5.5 Attenuation accuracy (A ), Attenuation accuracy (RMS) (A ) . 24
aur aur(RMS)
5.5.1 Purpose . 24
5.5.2 Measuring methods . 24

---------------------- Page: 4 ----------------------
IEC 60747-16-7:2022  IEC 2022 – 3 –
5.6 Input return loss (L ) . 26
ret(in)
5.6.1 Purpose . 26
5.6.2 Measuring methods . 26
5.7 Output return loss (L ) . 29
ret(out)
5.7.1 Purpose . 29
5.7.2 Measuring methods . 29
5.8 Input power at n dB compression (P ). 31
i(ndB)
5.8.1 Purpose . 31
5.8.2 Circuit diagram . 31
5.8.3 Principle of measurement . 31
5.8.4 Circuit description and requirements . 31
5.8.5 Precautions to be observed . 31
5.8.6 Measurement procedure . 31
5.8.7 Specified conditions . 31
5.9 Intermodulation distortion (two-tone)(P /P ) . 32
n 1
5.9.1 Purpose . 32
5.9.2 Circuit diagram . 32
5.9.3 Principle of measurement . 32
5.9.4 Circuit description and requirements . 33
5.9.5 Precautions to be observed . 33
5.9.6 Measurement procedure . 33
5.9.7 Specified conditions . 33
5.10 Power at the intercept point (for intermodulation products) (P ) . 34
n(IP)
5.10.1 Purpose . 34
5.10.2 Circuit diagram . 34
5.10.3 Principle of measurement . 34
5.10.4 Circuit description and requirements . 34
5.10.5 Precautions to be observed . 34
5.10.6 Measurement procedure . 34
5.10.7 Specified conditions . 34
5.11 Relative phase shift (θ ) . 35
rel
5.11.1 Purpose . 35
5.11.2 Circuit diagram . 35
5.11.3 Principle of measurement . 35
5.11.4 Circuit description and requirements . 35
5.11.5 Precautions to be observed . 35
5.11.6 Measurement procedure . 36
5.11.7 Specified conditions . 36
5.12 Turn on time(t ), turn off time(t ), rise time(t ), fall time(t ) . 36
on off r(out) f(out)
5.12.1 Purpose . 36
5.12.2 Circuit diagram . 36
5.12.3 Principle of measurement . 36
5.12.4 Circuit description and requirements . 38
5.12.5 Precautions to be observed . 38
5.12.6 Measurement procedure . 38
5.12.7 Specified conditions . 38
5.13 Control voltage sensitivity (S ) . 38
vcont

---------------------- Page: 5 ----------------------
– 4 – IEC 60747-16-7:2022  IEC 2022
5.13.1 Purpose . 38
5.13.2 Measuring methods . 38
Bibliography . 41

Figure 1 – Circuit diagram for the measurement of the transmission loss and insertion
loss (method 1) . 17
Figure 2 – Circuit diagram for the measurement of the scattering parameters . 19
Figure 3 – Circuit diagram for the measurement of the return loss (method 1) . 27
Figure 4 – Circuit diagram for the measurement of intermodulation distortion . 32
Figure 5 – Circuit diagram for the measurement of response times and switching times . 36
Figure 6 – Input and output waveforms . 37

Table 1 – Function of terminals . 12
Table 2 – Electrical limiting values . 14
Table 3 – Electrical limiting values in detail specification . 14
Table 4 – Temperatures . 14
Table 5 – Electrical characteristics . 15

---------------------- Page: 6 ----------------------
IEC 60747-16-7:2022  IEC 2022 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

SEMICONDUCTOR DEVICES –

Part 16-7: Microwave integrated circuits –
Attenuators

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 60747-16-7 has been prepared by subcommittee 47E: Discrete semiconductor devices, of
IEC technical committee 47: Semiconductor devices. It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
47E/794/FDIS 47E/798/RVD

Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.

---------------------- Page: 7 ----------------------
– 6 – IEC 60747-16-7:2022  IEC 2022
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/publications.
A list of all parts in the IEC 60747 series, published under the general title Semiconductor
devices, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

---------------------- Page: 8 ----------------------
IEC 60747-16-7:2022  IEC 2022 – 7 –
SEMICONDUCTOR DEVICES –

Part 16-7: Microwave integrated circuits –
Attenuators



1 Scope
This part of IEC 60747 specifies the terminology, essential ratings and characteristics, and
measuring methods of microwave integrated circuit attenuators.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60747-1:2006, Semiconductor devices – Part 1: General
IEC 60747-1:2006/AMD 1:2010
IEC 60747-4, Semiconductor devices – Discrete devices – Part 4: Microwave diodes and
transistors
IEC 61340-5-1, Electrostatics – Part 5-1: Protection of electronic devices from electrostatic
phenomena – General requirements
IEC TR 61340-5-2, Electrostatics – Part 5-2: Protection of electronic devices from electrostatic
phenomena – User guide
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at https://www.electropedia.org/
• ISO Online browsing platform: available at https://www.iso.org/obp
3.1
reference state
thru state
state of minimum attenuation
3.2
attenuation state
state in which the attenuation is greater than that in the reference state

---------------------- Page: 9 ----------------------
– 8 – IEC 60747-16-7:2022  IEC 2022
3.3
transmission loss
L
trans
ratio of the input power to the output power, in the linear region of the power transfer curve
P (dBm) = f(P )
o i
Note 1 to entry: In this region, ∆P (dBm) = ∆P (dBm).
o i
Note 2 to entry: Usually the transmission loss is expressed in decibels.
3.4
insertion loss

L
ins
ratio of the input power to the output power, in the linear region of the power transfer curve
P (dBm) = f(P ) in the reference state
o i
Note 1 to entry: In this region, ∆ P (dBm) =∆ P (dBm).
o i
Note 2 to entry: Usually the insertion loss is expressed in decibels.
[SOURCE: IEC 60747-16-4:2004/AMD 1:2009, 3.1, modified – “at the switched on port” has
been deleted and “in the reference state” has been added.]
3.5
attenuation value
A
att
difference between the insertion loss and the transmission loss in the attenuation state
3.6
attenuation range
A
ran
difference between the maximum and minimum attenuation value
3.7
attenuation accuracy
A
aur
maximum difference between the measured and the nominal attenuation values
3.8
attenuation accuracy (RMS)
A
aur (RMS)
root-mean-square value of the attenuation accuracy
3.9
input return loss
L
ret(in)
ratio of the incident power at the input port to the reflected power at the input port
[SOURCE: IEC 60747-16-6:2019, 3.4]
3.10
output return loss
L
ret(out)
ratio of the incident power at the output port to the reflected power at the output port
[SOURCE: IEC 60747-16-6:2019, 3.5]

---------------------- Page: 10 ----------------------
IEC 60747-16-7:2022  IEC 2022 – 9 –
3.11
input power at n dB compression
P
i(ndB)
input power where the transmission loss increases by n dB compared with transmission loss in
linear region
Note 1 to entry: Usually n is 0,25 for voltage variable attenuators and 0,1 for digital step attenuators.
3.12
intermodulation distortion
P /P
n 1
ratio of the nth order component of the output power to the fundamental component of the output
power
Note 1 to entry: The abbreviation “IMD ” is in common use for the nth order intermodulation distortion.
n
[SOURCE: IEC 60747-4:2007/AMD1:2017, 7.2.19]
3.13
power at the intercept point (for intermodulation products)
P
n(IP)
output power at intersection between the extrapolated output powers of the fundamental
th
component and the n order intermodulation components, when the extrapolation is carried out
in a diagram showing the output power of the components (in decibels) as a function of the
input power (in decibels)
[SOURCE: IEC 60747-16-1:2001, 3.8]
3.14
relative phase shift
θ
rel
phase shift in the attenuation state relative to that in the reference state
3.15
switching time
3.15.1
turn on time
t
on
interval between the reference point on the leading edge of the control voltage and the reference
point on the trailing edge of the envelope of the output voltage in the linear region of the power
transfer curve P (dBm) = f(P ) when the state of attenuator changes from the reference state to
o i
the attenuation state
Note 1 to entry: In this region, ∆P (dBm) = ∆P (dBm).
o i
Note 2 to entry: Usually the reference point is 50 % of the amplitude.
[SOURCE: IEC 60747-16-4:2004, 3.6, modified – Note 2 has been added, “the lower reference
point“ has been replaced by “the reference point”, “the upper reference point on the leading
edge” has been replaced by “the reference point on the trailing edge” and “when the state of
attenuator changes from the reference state to the attenuation state” has been added]

---------------------- Page: 11 ----------------------
– 10 – IEC 60747-16-7:2022  IEC 2022
3.15.2
turn off time
t
off
interval between the reference point on the trailing edge of the control voltage and the reference
point on the leading edge of the envelope of the output voltage in the linear region of the power
transfer curve P (dBm) = f(P ) when the state of attenuator changes from the attenuation state
o i
to the reference state
Note 1 to entry: In this region, ∆P (dBm) = ∆P (dBm).
o i
Note 2 to entry: Usually the reference is 50% of the amplitude.
[SOURCE: IEC 60747-16-4:2004, 3.7, modified – Note 2 has been added, “the upper reference
point“ has been replaced by “the reference point”, “the lower reference point on the trailing
edge” has been replaced by “the reference point on the leading edge” and “when the state of
attenua
...