IEC 60115-8:2023 is applicable to fixed surface mount resistors for use in electronic equipment. These resistors are typically described according to types (different geometric shapes) and styles (different dimensions) and product technology. These resistors have metallized terminations and are primarily intended to be mounted directly onto a circuit board.
The object of this document is to specify preferred ratings and characteristics and to select from IEC 60115-1, the appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements for this type of resistor.
This edition includes the following significant technical changes with respect to the previous edition:
a) definitions of product technologies and product classification levels of the generic specification, IEC 60115-1:2020, have been adopted;
b) new style of transverse (RT) resistors has been added in 3.1.5 and 4.2.2 to cover resistors with wide terminals, which have become common in market;
c) recommended test boards in 5.2.2 have been revised to fit the demands from the market for higher rated dissipation in resistors;
d) test boards have been revised so that they can be set vertically instead of horizontally during specified tests to optimize the temperature rise stability, area and spacing inside the test chamber;
e) 'Periodic-pulse high-voltage overload test' of IEC 60115‑1:2020, 8.3 has been added to the default test method in 5.3.8, however, the legacy test 'periodic-pulse overload test' of IEC 60115‑1:2020, 8.4 is still maintained for historical products;
and more. Please see the foreword for the list of changes.

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IEC 61189-2-804:2023 specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyser (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 °C, but are not limited to these values.

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IEC/TS 60871-3:2015(E) which is a technical specification, gives guidance on the protection of shunt capacitors and shunt capacitor banks. it applies to capacitors according to IEC 60871-1. This second edition cancels and replaces the first edition published in 2005. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
- Clearer writing of formulas on energy limitation for expulsion fuses;
- Updated normative references and bibliography;
- A new clause for synchronized switching has been added. Keywords: shunt capacitors, shunt capacitor banks

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IEC 60393-3:2023 applies to rotary precision potentiometers for use in electronic equipment. The object of this document is to prescribe preferred ratings and characteristics and to select from IEC 60393-1, the appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements for this type of potentiometer. This document gives the minimum performance requirements and test severities.
This edition includes the following significant technical changes with respect to the previous edition:
a) revised all parts of the document based on the ISO/IEC Directives, Part 2:2018 (eighth edition) and harmonized with other similar kinds of documents;
b) the document structure has been organized to follow new sectional specification structure decided in TC 40;
c) revision of the information on the assessment level EZ (zero nonconforming).

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SIST EN IEC 61967-8:2023 is available as IEC 61967-8:2023 which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 61967-8:2023 defines a method for measuring the electromagnetic radiated emission from an integrated circuit (IC) using an IC stripline. The IC being evaluated is mounted on an EMC test board (PCB) between the active conductor and the ground plane of the IC stripline arrangement. This edition includes the following significant technical changes with respect to the previous edition:
a) frequency range of 150 kHz to 3 GHz was deleted from the scope;
b) extension of upper usable frequency to 6 GHz or higher as long as the defined requirements are fulfilled.

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IEC 61076-2-115:2023 describes free and fixed 12P shielded circular connectors with 2 A rated current, rated voltage up to and including 50 V AC/DC, IP65/IP67 metal housing with push-pull locking (hereinafter referred to as a connectors) for use in electrical and electronic equipment. It includes overall dimensions, interface dimensions, technical characteristics, performance requirements and test methods.

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IEC 61249-2-51:2023 specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of base materials for integrated circuit card carrier tape, unclad (hereinafter referred to as IC carrier tape base materials).
This document is applicable to IC carrier tape base materials, which is a glue-coated material, one side is woven E-glass reinforced epoxy underlayer, and the other side is coated with adhesive and protected by release film.

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This document defines a number of conditions common to rectangular electrical modular connectors for receptacles, plugs and rack and panel, with interchangeable modules and continuous operating temperature 175 °C.

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IEC 60939-2:2005 applies to passive filter units for electromagnetic interference suppression which fall within the scope of the Generic Specification IEC 60939-1. The scope of this Sectional specification is restricted to passive filter units for which safety tests are appropriate. This implies that filters specified according to this Sectional specification will either be connected to mains supplies, when compliance with the mandatory tests of Table 3 is necessary, or used in other circuit positions where the equipment specification prescribes that some or all of these safety tests are required. The contents of the corrigendum of November 2005 have been included in this copy.

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IEC 61076-8-105:2023 applies to free and fixed 2-pole snap locking rectangular power connectors with plastic housing with rated current 63 A and rated voltage up to 400 V. It includes overall dimensions, interface dimensions, technical characteristics, performance requirements, test methods.

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IEC 62899-202-10:2023 defines terminology and measurement methods for the resistance change of conductive ink layer(s) as a function of thermoplastic elongation. The method measures resistance changes in-situ or post-elongation.
This document is applicable to thermoformable substrates with conductive ink layers. The thermoformable substrates can have printed graphic ink as well and cover insulation layers.

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IEC 62899-202-9:2023 describes basic patterns to evaluate the electrical reliability of a conductive layer under mechanical deformation. Using the standard pattern described in this document, the comparison of the electrical reliability of a conductive layer under mechanical deformation is possible when the sample dimension is identical.

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IEC 61189-2-801:2023 defines a test method to be followed for thermal performance via carbon ink heating. The method employs a screened-on pattern of carbon ink used to determine the thermal performance of a dielectric layer on a metal base plate.

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IEC 61189-2-803:2023 specifies a test method to determine the Z-axis expansion of base materials and printed boards using a thermomechanical analyser (TMA).

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IEC 61076-3-106:2023 constitutes a detail product specification for 8-way connectors for data transmission with frequencies up to 600 MHz.
It covers protective housings for upgrading existing 8-way shielded and unshielded connectors utilizing the interface described in the IEC 60603-7 series to IP65/IP67 rating according to IEC 60529, for use in industrial environments.
The housings cover a variety of different locking mechanisms according to this document and a variety of different mounting configurations and termination types which are detailed in the IEC 60603-7 series.
Common mating configurations for all variants are defined in IEC 60603-7. The mating dimensions for the housings under Clause 3 allow the mating conditions under IEC 60603-7 to be fulfilled.
The fully assembled variants (connectors) described in this document incorporate fully compliant IEC 60603-7 series fixed and free connectors.

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This document specifies test methods for the determination of the linear optical phase retardation of optical components by polarized laser beams.

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This document specifies test methods for the determination of the linear optical phase retardation of optical components by polarized laser beams.

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IEC 61076-2-115:2023 describes free and fixed 12P shielded circular connectors with 2 A rated current, rated voltage up to and including 50 V AC/DC, IP65/IP67 metal housing with push-pull locking (hereinafter referred to as a connectors) for use in electrical and electronic equipment. It includes overall dimensions, interface dimensions, technical characteristics, performance requirements and test methods.

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IEC 62977-3-9:2023 specifies standard measurement conditions and methods for determining the sparkle contrast of direct-view displays which comprise display matrix elements to render real 2D images on a flat panel and an anti-glare layer. This document excludes measurement of sparkle, which is intentionally obtained by the specular reflection from reflecting flakes in coatings and paints.

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IEC 61249-2-51:2023 specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of base materials for integrated circuit card carrier tape, unclad (hereinafter referred to as IC carrier tape base materials). This document is applicable to IC carrier tape base materials, which is a glue-coated material, one side is woven E-glass reinforced epoxy underlayer, and the other side is coated with adhesive and protected by release film.

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IEC 61249-6-3:2023 covers finished fabrics woven from ‘‘E’’ glass electrical grade glass fibre yarns that are intended as a reinforcing material in laminated plastics for electrical and electronic use. All fabrics covered by this specification are plain weave.
This specification determines the nomenclature, definitions, general and chemical requirements for the glass, and physical requirements for finished woven glass fibre fabrics.
Annex A of this document provides a style designator for each finished fabric glass style, with specifications on yarn, fabric count, thickness and weight in both SI and US system.
This standard cancels and replaces IEC/PAS 61249-6-3 published in 2011. This edition constitutes a technical revision.

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IEC 61967-8:2023 is available as IEC 61967-8:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 61967-8:2023 defines a method for measuring the electromagnetic radiated emission from an integrated circuit (IC) using an IC stripline. The IC being evaluated is mounted on an EMC test board (PCB) between the active conductor and the ground plane of the IC stripline arrangement. This edition includes the following significant technical changes with respect to the previous edition: a) frequency range of 150 kHz to 3 GHz was deleted from the scope; b) extension of upper usable frequency to 6 GHz or higher as long as the defined requirements are fulfilled.

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This International Standard retains IEC 61984:2008 as the minimum performance requirements for railway rolling stock electrical connectors.
It identifies additional terms, test methods and performance requirements for single-pole and multipole connectors with rated voltages up to 1 000 V, rated currents up to 125 A per contact and frequencies below 3 MHz used for indoor and outdoor applications in railway rolling stock.
This International Standard does not cover:
- connectors with breaking capacity (CBCs) as defined in IEC 61984:2008, 3.2, because on board rolling stock connectors are not intended to be operated (i.e. mated and unmated) under load or when live, either by means of procedures or by the presence of interlocks, as required by IEC 61991;
- non-rewirable connectors as defined in IEC 61984:2008, 3.5;
- automatic couplers, due to their additional mechanical complexity and the need for more specific requirements and testing;
- inter-vehicle jumpers, as they are connector and cable assemblies whose characteristics depend on those of both elements. Inter-vehicle connectors within the limits set in the scope of this International Standard are therefore covered by the agreed choice of suitable mechanical and environmental characteristics as defined by Annex B, and suggested by Annex C.
This International Standard identifies the application levels for electrical connectors based on
a) the severity of the service conditions in different rolling stock technologies,
b) the intended use of the rolling stock,
c) the location of the connector in the rolling stock system.
This International Standard is not applicable to internal connections of electronic devices such as connectors for printed boards and rack-and-panel connectors.

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IEC TR 61191-9:2023, which is a Technical Report, applies to electronic and electromechanical automotive circuit board assemblies and describes current best practices for dealing with electrochemical reactions like migration or corrosion and ionic contamination on the surface of a circuit board as one failure mode under humidity load. This document deals with the evaluation of materials and manufacturing processes for the manufacturing of electronic assemblies with focus on their reliability under humidity loads. The electrical operation of a device in a humid environment can trigger electrochemical reactions that can lead to short circuits and malfunctions on the assembly. In this context, a large number of terms and methods are mentioned, such as CAF (conductive anodic filament), anodic migration phenomena, dendrite growth, cathodic migration, ROSE (resistivity of solvent extract), ionic contamination, SIR (surface insulation resistance), impedance spectroscopy, etc., which are used and interpreted differently. The aim of the document is to achieve a uniform use of language and to list the possibilities and limitations of common measurement methods. The focus of the document is on the error pattern of electrochemical migration on the surface of assemblies with cathodic formation of dendrites.
Evaluation of different test methods of control units under high humidity load are not part of this document.

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This part of IEC 63287 gives guidelines for the development of reliability qualification plans
using the concept of mission profile, based on the environmental conditioning and proposed
usage of the product. This document is not intended for military- and space-related applications.

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IEC 61076-2-115:2023 describes free and fixed 12P shielded circular connectors with 2 A rated current, rated voltage up to and including 50 V AC/DC, IP65/IP67 metal housing with push-pull locking (hereinafter referred to as a connectors) for use in electrical and electronic equipment. It includes overall dimensions, interface dimensions, technical characteristics, performance requirements and test methods.

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IEC 63171-7:2023 covers shielded free and fixed circular connectors with 4 ways up to 7 ways for power and data transmission and specifies the common dimensions, mechanical, electrical and transmission characteristics and environmental requirements as well as test specifications respectively.
The connectors described in this document are either equipped with an M12 screw-locking mechanism (styles with M12 in the name) or a quick-locking push-pull mechanism with a size derived from that (styles with P12 in the name) or both mechanisms combined (styles with C12 in the name). For the sake of simplicity, the connectors' size is denoted as "size 12" in this document.
This document provides multiple mating interfaces each of which is associated with a coding preventing the mating of incompatible male and female connectors. These codings are referred to as "Type x", where "x" is represented by a Roman numeral.
For all codings, two ways and the additional shield pin, which is intended to be connected to the cable screen, support differential data transmission with frequencies up to 600 MHz by meeting the requirements of Category B, as defined in IEC 63171.

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IEC 63098-4:2023 provides the performance standards of the RoF-based 5G indoor distributed antenna system (DAS) network for cost-effectively offering quality of service (QoS) guaranteed 5G mobile communication services with high bandwidth and low-latency characteristics without radio shadowing in an indoor environment. First of all, the system overview, system configurations, and the elements of the system are presented and then the electrical and optical interfaces for each system element are defined. Finally, the detail system performance specifications of each element are described for downlink and uplink configurations.

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IEC 61076-8-109:2023 describes free and fixed rectangular connectors with:
- 2P power plus 2P signal contacts;
- plastic housing with locking lever and four possible codings;
- 130 A rated current, 1 000 V DC rated voltage on the power section;
- 5 A rated current, 50 V DC rated voltage on the signal section;
- individual shielding around each power contact with relevant shielding termination;
- IP65/IP68 degree of protection when mated and locked and IPXXB on both plug, and receptacle parts when unmated;
- hereinafter referred to as a connector, for use in electrical and electronic equipment, including overall dimensions, interface dimensions, technical characteristics, performance requirements and test methods.

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This part of IEC 63287 gives guidelines for the development of reliability qualification plans using the concept of mission profile, based on the environmental conditioning and proposed usage of the product. This document is not intended for military- and space-related applications.

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IEC 61076-8-107:2023 describes free and fixed rectangular connectors with:
- 2P power plus 2P signal contacts;
- plastic housing with locking lever and four possible codings;
- 200 A rated current, 1 000 V DC rated voltage on the power section;
- 5 A rated current, 50 V DC rated voltage on the signal section;
- individual shielding around each power contact with relevant shielding termination;
- IP65/IP68 degree of protection when mated and locked, and IPXXB on both plug and receptacle parts when unmated;
- hereinafter referred to as a connector, for use in electrical and electronic equipment, including overall dimensions, interface dimensions, technical characteristics, performance requirements and test methods.

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IEC 61249-2-51:2023 specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of base materials for integrated circuit card carrier tape, unclad (hereinafter referred to as IC carrier tape base materials).
This document is applicable to IC carrier tape base materials, which is a glue-coated material, one side is woven E-glass reinforced epoxy underlayer, and the other side is coated with adhesive and protected by release film.

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IEC 61076-8-103:2023 describes free and fixed 2-pole power (1P+N) plus PE circular connectors with 20 A rated current, rated voltage up to and including 300 V AC, IP65/IP67 metal housing with push-pull locking (hereinafter referred to as a connectors) for use in electrical and electronic equipment. It includes overall dimensions, interface dimensions, technical characteristics, performance requirements and test methods.

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IEC 61967-8:2023 is available as IEC 61967-8:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 61967-8:2023 defines a method for measuring the electromagnetic radiated emission from an integrated circuit (IC) using an IC stripline. The IC being evaluated is mounted on an EMC test board (PCB) between the active conductor and the ground plane of the IC stripline arrangement. This edition includes the following significant technical changes with respect to the previous edition:
a) frequency range of 150 kHz to 3 GHz was deleted from the scope;
b) extension of upper usable frequency to 6 GHz or higher as long as the defined requirements are fulfilled.

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IEC 61076-8-108:2023 describes free and fixed rectangular connectors with:
- 2P power plus 2P signal contacts;
- plastic housing with locking lever and four possible codings;
- 250 A rated current, 1 000 V DC rated voltage on the power section;
- 5 A rated current, 50 V DC rated voltage on the signal section;
- individual shielding around each power contact with relevant shielding termination;
- IP65/IP68 degree of protection when mated and locked, and IPXXB on both plug and receptacle parts when unmated, hereinafter referred to as a connector, for use in electrical and electronic equipment, including overall dimensions, interface dimensions, technical characteristics, performance requirements and test methods.

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IEC 61076-8-104:2023 describes free and fixed 2-pole circular power connectors with 40 A rated current, rated voltage up to and including 50 V AC/DC, and push-pull locking IP65/IP67 metal housings (hereinafter referred to as connectors) for use in electrical and electronic equipment. It includes overall dimensions, interface dimensions, technical characteristics, performance requirements and test methods.

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IEC 62899-202:2023 is available as IEC 62899-202:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 62899-202:2023 defines the terms and specifies the standard test methods for characterization and evaluation of conductive inks. This document also provides measurement methods for evaluating the properties of conductive layers made both from an additive process using conductive inks and from a subtractive process used in printed electronics. This edition includes the following significant technical changes with respect to the previous edition:
a) definitions of conductive material, conductive ink and conductive layer have been revised;
b) a summary of test methods is added;
c) mechanical tests for conductive layer are added.

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This document specifies procedures for the absorption measurement and high spatial-resolution two-dimensional or three-dimensional absorption mapping of optical laser components, and upon calibration, the measurement of absolute absorptance of laser optics. The methods given in this document are intended to be used for the two-dimensional or three-dimensional absorption mapping of optical laser components, that is, measurement of absorption as a function of position, as well as absorption/absorptance measurement and mapping of laser optics used in high-power/high-energy laser systems.

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